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NXP |
MOSFET N-CH 20V 3.2A SOT-23
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 20V
- Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
- Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
- Vgs(th) (Max) @ Id: 1.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs: 7.4nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds: 420pF @ 15V
- Vgs (Max): ±12V
- FET Feature: -
- Power Dissipation (Max): 380mW (Ta)
- Rds On (Max) @ Id, Vgs: 35 mOhm @ 3.2A, 4.5V
- Operating Temperature: -55°C ~ 150°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: TO-236AB (SOT23)
- Package / Case: TO-236-3, SC-59, SOT-23-3
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Package: TO-236-3, SC-59, SOT-23-3 |
Stock141,612 |
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NXP |
MOSFET N-CH 55V 28.43A LFPAK
- FET Type: N-Channel
- Technology: MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss): 55V
- Current - Continuous Drain (Id) @ 25°C: 28.43A (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 10V
- Vgs(th) (Max) @ Id: 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 13.1nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 781pF @ 25V
- Vgs (Max): ±20V
- FET Feature: -
- Power Dissipation (Max): 60W (Tc)
- Rds On (Max) @ Id, Vgs: 35 mOhm @ 15A, 10V
- Operating Temperature: -55°C ~ 175°C (TJ)
- Mounting Type: Surface Mount
- Supplier Device Package: LFPAK56, Power-SO8
- Package / Case: SC-100, SOT-669
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Package: SC-100, SOT-669 |
Stock2,816 |
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NXP |
IC REG LINEAR 2V 300MA 4WLCSP
- Output Configuration: Positive
- Output Type: Fixed
- Number of Regulators: 1
- Voltage - Input (Max): 5.5V
- Voltage - Output (Min/Fixed): 2V
- Voltage - Output (Max): -
- Voltage Dropout (Max): 0.16V @ 300mA
- Current - Output: 300mA
- Current - Quiescent (Iq): -
- Current - Supply (Max): 100µA ~ 250µA
- PSRR: 55dB (1kHz)
- Control Features: Enable
- Protection Features: Over Current, Over Temperature
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 4-XFBGA, WLCSP
- Supplier Device Package: 4-WLCSP (0.76x0.76)
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Package: 4-XFBGA, WLCSP |
Stock4,464 |
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NXP |
MOSFET N-CH 50V 4A SOT427
- Switch Type: General Purpose
- Number of Outputs: 2
- Ratio - Input:Output: 1:1
- Output Configuration: High Side
- Output Type: N-Channel
- Interface: On/Off
- Voltage - Load: 5.5 V ~ 35 V
- Voltage - Supply (Vcc/Vdd): Not Required
- Current - Output (Max): 4A
- Rds On (Typ): 73 mOhm
- Input Type: Non-Inverting
- Features: -
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB
- Supplier Device Package: D2PAK
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Package: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB |
Stock7,680 |
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NXP |
IC SWITCH 6X LOW-SIDE 30-HSOP
- Switch Type: General Purpose
- Number of Outputs: 6
- Ratio - Input:Output: 1:1
- Output Configuration: Low Side
- Output Type: N-Channel
- Interface: SPI, Parallel
- Voltage - Load: 8 V ~ 25 V
- Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
- Current - Output (Max): -
- Rds On (Typ): 400 mOhm
- Input Type: -
- Features: -
- Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 30-BSOP (0.433", 11.00mm Width) Exposed Pad
- Supplier Device Package: 30-HSOP
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Package: 30-BSOP (0.433", 11.00mm Width) Exposed Pad |
Stock7,392 |
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NXP |
IC BUFF DVR TRI-ST 16BIT 56VFBGA
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 4
- Number of Bits per Element: 4
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 2.7 V ~ 3.6 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 56-VFBGA
- Supplier Device Package: 56-VFBGA (4.5x7)
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Package: 56-VFBGA |
Stock6,560 |
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NXP |
IC BUFF/DVR TRI-ST 8BIT 20SSOP
- Logic Type: Buffer, Non-Inverting
- Number of Elements: 1
- Number of Bits per Element: 8
- Input Type: -
- Output Type: Push-Pull
- Current - Output High, Low: 32mA, 64mA
- Voltage - Supply: 4.5 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 20-SSOP (0.209", 5.30mm Width)
- Supplier Device Package: 20-SSOP
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Package: 20-SSOP (0.209", 5.30mm Width) |
Stock7,424 |
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NXP |
IC UART DUAL 40-DIP
- Features: Configurable GPIO, Internal Oscillator, Timer/Counter
- Number of Channels: 2, DUART
- FIFO's: -
- Protocol: -
- Data Rate (Max): 1Mbps
- Voltage - Supply: 5V
- With Auto Flow Control: Yes
- With IrDA Encoder/Decoder: -
- With False Start Bit Detection: Yes
- With Modem Control: -
- Mounting Type: Through Hole
- Package / Case: 40-DIP (0.600", 15.24mm)
- Supplier Device Package: 40-DIP
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Package: 40-DIP (0.600", 15.24mm) |
Stock6,832 |
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NXP |
IC I2C MUX 4CH 20SOIC
- Applications: Translating Switch
- Interface: I2C, SMBus
- Voltage - Supply: 2.3 V ~ 3.6 V, 4.5 V ~ 5.5 V
- Package / Case: 20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 20-SO
- Mounting Type: Surface Mount
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Package: 20-SOIC (0.295", 7.50mm Width) |
Stock7,904 |
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NXP |
IC I/O EXPANDER I2C 16B 24DHVQFN
- Number of I/O: 16
- Interface: I2C
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 100µA, 25mA
- Clock Frequency: 1MHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 24-VFQFN Exposed Pad
- Supplier Device Package: 24-DHVQFN (5.5x3.5)
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Package: 24-VFQFN Exposed Pad |
Stock4,224 |
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NXP |
IC I/O EXPANDER I2C 8B 16DIP
- Number of I/O: 8
- Interface: I2C, SMBus
- Interrupt Output: Yes
- Features: POR
- Output Type: Push-Pull
- Current - Output Source/Sink: 10mA, 25mA
- Clock Frequency: 400kHz
- Voltage - Supply: 2.3 V ~ 5.5 V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Through Hole
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock6,432 |
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NXP |
IC MUX/DEMUX TRIPLE 2X1 16DIP
- Switch Circuit: SPDT
- Multiplexer/Demultiplexer Circuit: 2:1
- Number of Circuits: 3
- On-State Resistance (Max): 105 Ohm
- Channel-to-Channel Matching (ΔRon): 2 Ohm
- Voltage - Supply, Single (V+): 1 V ~ 6 V
- Voltage - Supply, Dual (V±): -
- Switch Time (Ton, Toff) (Max): 31ns, 24ns
- -3db Bandwidth: 200MHz
- Charge Injection: -
- Channel Capacitance (CS(off), CD(off)): 3.5pF
- Current - Leakage (IS(off)) (Max): 2µA
- Crosstalk: -60dB @ 1MHz
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 16-DIP (0.300", 7.62mm)
- Supplier Device Package: 16-DIP
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Package: 16-DIP (0.300", 7.62mm) |
Stock5,232 |
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NXP |
IC MPU MPC85XX 1.333GHZ 1023BGA
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.333GHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000 Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: Cryptography, Random Number Generator
- Package / Case: 1023-BFBGA, FCBGA
- Supplier Device Package: 1023-FCPBGA (33x33)
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Package: 1023-BFBGA, FCBGA |
Stock5,680 |
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NXP |
IC MPU I.MX6D 1.0GHZ 624FCBGA
- Core Processor: ARM? Cortex?-A9
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON? SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000 Mbps (1)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 + PHY (4)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -20°C ~ 105°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 624-FBGA, FCBGA
- Supplier Device Package: 624-FCBGA (21x21)
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Package: 624-FBGA, FCBGA |
Stock18,864 |
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NXP |
IC MCU 8BIT 4KB FLASH 16TSSOP
- Core Processor: S08
- Core Size: 8-Bit
- Speed: 20MHz
- Connectivity: I2C, SCI, SPI
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 12
- Program Memory Size: 4KB (4K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256 x 8
- Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 16-TSSOP
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Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock7,920 |
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NXP |
IC MCU 8BIT 16KB FLASH 28SOIC
- Core Processor: HC08
- Core Size: 8-Bit
- Speed: 8MHz
- Connectivity: I2C, SCI
- Peripherals: LED, LVD, POR, PWM
- Number of I/O: 23
- Program Memory Size: 16KB (16K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512 x 8
- Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
- Data Converters: A/D 12x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 28-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 28-SOIC
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Package: 28-SOIC (0.295", 7.50mm Width) |
Stock6,544 |
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NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
- Core Processor: HCS12
- Core Size: 16-Bit
- Speed: 16MHz
- Connectivity: CAN, I2C, SCI, SPI
- Peripherals: LCD, POR, PWM, WDT
- Number of I/O: 85
- Program Memory Size: 128KB (128K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4K x 8
- RAM Size: 6K x 8
- Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
- Data Converters: A/D 8x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
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Package: 112-LQFP |
Stock11,676 |
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NXP |
IC MCU 32BIT 512KB FLASH 144LQFP
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
- Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 4032 x 8
- RAM Size: 96K x 8
- Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
- Data Converters: A/D 8x12b, D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock4,128 |
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NXP |
IC MCU 32BIT 256KB FLASH 121BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 72MHz
- Connectivity: CAN, I2C, IrDA, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 74
- Program Memory Size: 256KB (256K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 2K x 8
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 34x16b, D/A 1x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 121-LFBGA
- Supplier Device Package: 121-MAPBGA (8x8)
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Package: 121-LFBGA |
Stock5,072 |
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NXP |
IC MCU 32BIT 512KB FLASH 121BGA
- Core Processor: ARM? Cortex?-M4
- Core Size: 32-Bit
- Speed: 100MHz
- Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O: 86
- Program Memory Size: 512KB (512K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 128K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 38x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 121-LBGA
- Supplier Device Package: 121-MAPBGA (8x8)
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Package: 121-LBGA |
Stock5,248 |
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NXP |
IC I-CODE SLI SOT1122
- Type: RFID Transponder
- Frequency: 13.56MHz
- Standards: ISO 15693, ISO 18000-3
- Interface: -
- Voltage - Supply: 1.5 V ~ 1.7 V
- Operating Temperature: -40°C ~ 85°C
- Package / Case: Die
- Supplier Device Package: -
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Package: Die |
Stock3,420 |
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NXP |
POWER MODULE GSM800 EDGE SOT365C
- Frequency: 869MHz ~ 894MHz
- P1dB: -
- Gain: 30dB
- Noise Figure: -
- RF Type: GSM, EDGE
- Voltage - Supply: 30V
- Current - Supply: 245mA ~ 320mA
- Test Frequency: -
- Package / Case: SOT-365C
- Supplier Device Package: SOT-365C
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Package: SOT-365C |
Stock4,752 |
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NXP |
BCC14
- Function: Battery Cell Controller
- Battery Chemistry: Lithium-Ion
- Number of Cells: 7 ~ 14
- Fault Protection: Over/Under Voltage
- Interface: TPL
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 64-LQFP Exposed Pad
- Supplier Device Package: 64-LQFP (10x10)
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Package: 64-LQFP Exposed Pad |
Stock7,168 |
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NXP |
NXP 32-BIT MCU POWER ARCH CORE
- Core Processor: e200z0h
- Core Size: 32-Bit
- Speed: 48MHz
- Connectivity: CANbus, I²C, LINbus, SCI, SPI
- Peripherals: DMA, POR, PWM, WDT
- Number of I/O: 79
- Program Memory Size: 384KB (384K x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 28K x 8
- Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
- Data Converters: A/D 28x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: -
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
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Package: 100-LQFP |
Stock4,192 |
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NXP |
KINETIS K63: 120MHZ CORTEX-M4F M
- Core Processor: ARM® Cortex®-M4
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
- Peripherals: DMA, I²S, LVD, POR, PWM, WDT
- Number of I/O: 100
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
- Data Converters: A/D 41x16b, D/A 2x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: -
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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Package: 144-LQFP |
Stock7,456 |
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NXP |
S32G233A ARM CORTEX-M7 AND -A53,
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
- Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
- Speed: 400MHz, 1GHz
- Co-Processors/DSP: Multimedia; NEON
- RAM Controllers: DDR3L, LPDDR4
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 1/2.5Gbps (4)
- SATA: -
- USB: USB 2.0 OTG (1)
- Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
- Package / Case: 525-FBGA, FCBGA
- Supplier Device Package: 525-FCPBGA (19x19)
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Package: - |
Request a Quote |
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NXP |
IC
- Core Processor: -
- Core Size: -
- Speed: -
- Connectivity: -
- Peripherals: -
- Number of I/O: -
- Program Memory Size: -
- Program Memory Type: -
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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Package: - |
Request a Quote |
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NXP |
SAFETY POWER MANAGEMENT IC, QFN5
- Applications: System Basis Chip
- Current - Supply: 15mA
- Voltage - Supply: 60V
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount, Wettable Flank
- Package / Case: 56-VFQFN Exposed Pad
- Supplier Device Package: 56-HVQFN (8x8)
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Package: - |
Request a Quote |
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