Page 630 - NXP Products | Heisener Electronics

MRF8P26080HR3
NXP

FET RF 2CH 65V 2.62GHZ NI780-4

Package: NI-780-4

Stock7,040
MHT1001HR5
NXP

IC TRANS RF LDMOS 2450MHZ

Package: SOT-979A

Stock7,824
AFT09S200W02SR3
NXP

TRANSISTOR RF LDMOS 4W PLD

Package: -

Stock4,816
AFT09S200W02NR3
NXP

FET RF 70V 960MHZ PLD

Package: OM-780-2

Stock4,896
PCA8551ATT/AJ
NXP

IC LCD DRIVER 36X4 48TSSOP

Package: 48-TFSOP (0.240", 6.10mm Width)

Stock2,032
74LVCH32374AEC/G;5
NXP

IC D-TYPE POS TRG QUAD 96LFBGA

Package: 96-LFBGA

Stock2,624
74ABT125D/AUJ
NXP

IC BUFFER QUAD 3-STATE 14SOIC

Package: 14-SOIC (0.154", 3.90mm Width)

Stock3,920
SA5232N/01,112
NXP

IC OPAMP GP 2.5MHZ RRO 8DIP

Package: 8-DIP (0.300", 7.62mm)

Stock4,208
SC68C752BIB48,151
NXP

IC UART DUAL W/FIFO 48-LQFP

Package: 48-LQFP

Stock2,976
PCAL6408ABSHP
NXP

IC I/O EXPANDER 8BIT I2C 16HVQFN

Package: 16-VFQFN Exposed Pad

Stock4,992
KMPC8349EZUAJDB
NXP

IC MPU MPC83XX 533MHZ 672TBGA

Package: 672-LBGA

Stock5,840
MPC8343ZQADD
NXP

IC MPU MPC83XX 266MHZ 620BGA

Package: 620-BBGA Exposed Pad

Stock5,552
MC68020CRC25E
NXP

IC MPU M680X0 25MHZ 114PGA

Package: 114-BPGA

Stock5,104
SPC5747GK1MKU6
NXP

IC MCU 32BIT 4MB FLASH 176LQFP

Package: 176-LQFP Exposed Pad

Stock2,016
MK26FN2M0CAC18R
NXP

IC MCU 32BIT 2MB FLASH 169WLCSP

Package: 169-UFBGA, WLCSP

Stock2,976
MKE15Z256VLH7
NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Package: 64-LQFP

Stock8,628
MDE6IC9120GNR1
NXP

MOSFET N-CH RF 900MHZ TO-270-16

Package: TO-270-16 Variant, Gull Wing

Stock4,806
T4081NSE7PQB
NXP

QORIQ 64B POWER 8X 1.5GHZ THRE

Package: -

Stock7,008
S912XDP512J1VALR
NXP

912XDP512J1 GENERAL

Package: 112-LQFP

Stock5,312
SPC5604BAMLL6R
NXP

NXP 32-BIT MCU POWER ARCH CORE

Package: 100-LQFP

Stock3,920

Part Number	Manufacturer	Description	Package	Stock
MRF8P26080HR3	NXP	FET RF 2CH 65V 2.62GHZ NI780-4 Transistor Type: LDMOS (Dual) Frequency: 2.62GHz Gain: 15dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 300mA Power - Output: 14W Voltage - Rated: 65V Package / Case: NI-780-4 Supplier Device Package: NI-780-4	Package: NI-780-4	Stock7,040
MHT1001HR5	NXP	IC TRANS RF LDMOS 2450MHZ Transistor Type: LDMOS (Dual) Frequency: 2.39GHz Gain: 14dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.9A Power - Output: 40W Voltage - Rated: 68V Package / Case: SOT-979A Supplier Device Package: NI-1230-4H	Package: SOT-979A	Stock7,824
AFT09S200W02SR3	NXP	TRANSISTOR RF LDMOS 4W PLD Transistor Type: - Frequency: - Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: - Package / Case: - Supplier Device Package: -	Package: -	Stock4,816
AFT09S200W02NR3	NXP	FET RF 70V 960MHZ PLD Transistor Type: LDMOS Frequency: 960MHz Gain: 19.2dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.4A Power - Output: 56W Voltage - Rated: 70V Package / Case: OM-780-2 Supplier Device Package: OM-780-2	Package: OM-780-2	Stock4,896
PCA8551ATT/AJ	NXP	IC LCD DRIVER 36X4 48TSSOP Display Type: LCD Configuration: 144 Segment Interface: I2C Digits or Characters: 9 Characters, 18 Characters, 144 Elements Current - Supply: 1.8µA Voltage - Supply: 1.8 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	Package: 48-TFSOP (0.240", 6.10mm Width)	Stock2,032
74LVCH32374AEC/G;5	NXP	IC D-TYPE POS TRG QUAD 96LFBGA Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 4 Number of Bits per Element: 8 Clock Frequency: 300MHz Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.65 V ~ 3.6 V Current - Quiescent (Iq): 40µA Input Capacitance: 5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 96-LFBGA	Package: 96-LFBGA	Stock2,624
74ABT125D/AUJ	NXP	IC BUFFER QUAD 3-STATE 14SOIC Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 1 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	Package: 14-SOIC (0.154", 3.90mm Width)	Stock3,920
SA5232N/01,112	NXP	IC OPAMP GP 2.5MHZ RRO 8DIP Amplifier Type: General Purpose Number of Circuits: 2 Output Type: Rail-to-Rail Slew Rate: 0.8 V/µs Gain Bandwidth Product: - -3db Bandwidth: 2.5MHz Current - Input Bias: 90nA Voltage - Input Offset: 200µV Current - Supply: 1.4mA Current - Output / Channel: 12mA Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V Operating Temperature: -40°C ~ 85°C Mounting Type: Through Hole Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP	Package: 8-DIP (0.300", 7.62mm)	Stock4,208
SC68C752BIB48,151	NXP	IC UART DUAL W/FIFO 48-LQFP Features: - Number of Channels: 2, DUART FIFO's: 64 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	Package: 48-LQFP	Stock2,976
PCAL6408ABSHP	NXP	IC I/O EXPANDER 8BIT I2C 16HVQFN Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-HVQFN (3x3)	Package: 16-VFQFN Exposed Pad	Stock4,992
KMPC8349EZUAJDB	NXP	IC MPU MPC83XX 533MHZ 672TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 672-LBGA Supplier Device Package: 672-TBGA (35x35)	Package: 672-LBGA	Stock5,840
MPC8343ZQADD	NXP	IC MPU MPC83XX 266MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	Package: 620-BBGA Exposed Pad	Stock5,552
MC68020CRC25E	NXP	IC MPU M680X0 25MHZ 114PGA Core Processor: 68020 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 114-BPGA Supplier Device Package: 114-PGA (34.54x34.54)	Package: 114-BPGA	Stock5,104
SPC5747GK1MKU6	NXP	IC MCU 32BIT 4MB FLASH 176LQFP Core Processor: e200z2, e200z4, e200z4 Core Size: 32-Bit Tri-Core Speed: 80MHz/160MHz Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	Package: 176-LQFP Exposed Pad	Stock2,016
MK26FN2M0CAC18R	NXP	IC MCU 32BIT 2MB FLASH 169WLCSP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 116 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 2x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 169-UFBGA, WLCSP Supplier Device Package: 169-WLCSP (5.5x5.63)	Package: 169-UFBGA, WLCSP	Stock2,976
MKE15Z256VLH7	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 72MHz Connectivity: CAN, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Number of I/O: 58 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock8,628
MDE6IC9120GNR1	NXP	MOSFET N-CH RF 900MHZ TO-270-16 Frequency: 920MHz ~ 960MHz P1dB: 50.8dBm (120W) Gain: 32dB Noise Figure: - RF Type: Cellular, W-CDMA Voltage - Supply: 28V Current - Supply: 550mA Test Frequency: 940MHz Package / Case: TO-270-16 Variant, Gull Wing Supplier Device Package: TO-270 WBL-16 GULL	Package: TO-270-16 Variant, Gull Wing	Stock4,806
T4081NSE7PQB	NXP	QORIQ 64B POWER 8X 1.5GHZ THRE Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Stock7,008
S912XDP512J1VALR	NXP	912XDP512J1 GENERAL Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b, 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	Package: 112-LQFP	Stock5,312
SPC5604BAMLL6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock3,920
FS32K144MNT0MLHT	NXP	S32K144 32-BIT MCU ARM CORTEX-M Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	Package: 64-LQFP	Stock2,144
TJA1044VTK/3Z	NXP	IC TRANSCEIVER HALF 1/1 8HVSON Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 300mV Data Rate: 5Mbps Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	Package: 8-VDFN Exposed Pad	Stock44,040
MPC8313ZQAFFC	NXP	IC MPU POWERQUICC II PRO 516PBGA Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	Package: 516-BBGA Exposed Pad	Stock2,064
S9S12GN16J1CLC	NXP	IC MCU 16BIT 16KB FLASH 32LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	Package: -	Request a Quote
K32L2A31VLL1A	NXP	K32 L2A 100LQFP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 72MHz Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Number of I/O: 86 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: -	Request a Quote
MIMX8UD5DVP08SC	NXP	I.MX8ULP,DUAL 800MHZ Core Processor: ARM® Cortex®-A35 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 800MHz Co-Processors/DSP: 3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP RAM Controllers: LPDDR3, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-CSI, MIPI-DSI Ethernet: 10/100Mbps SATA: - USB: USB 2.0 (2) Voltage - I/O: - Operating Temperature: 0°C ~ 95°C (TJ) Security Features: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MIMX8MN5DVTJZAA	NXP	IC MPU I.MX8MN 1.5GHZ 486LFBGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-LFBGA (14x14)	Package: -	Stock57
MFS2611AMDA0ADR2	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	Package: -	Request a Quote