Page 631 - NXP Products | Heisener Electronics

MRF6VP3450HSR6
NXP

FET RF 2CH 110V 860MHZ NI1230S

Package: NI-1230S

Stock3,056
2PA1576S/ZLX
NXP

TRANS PNP GEN PURPOSE SC70

Package: SC-70, SOT-323

Stock4,576
MC34VR500V3ESR2
NXP

IC REG 9OUT BUCK/LDO 56QFN

Package: 56-VFQFN Exposed Pad

Stock6,384
TEA1995T/1J
NXP

IC CTRLR SYNC RECT 8SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock2,864
PCA9553TK,118
NXP

IC LED DRVR LIN DIM 25MA 8HVSON

Package: 8-VFDFN Exposed Pad

Stock5,536
CBT6810PW,112
NXP

IC BUS SWITCH 10BIT 24TSSOP

Package: 24-TSSOP (0.173", 4.40mm Width)

Stock3,296
TDA8922TH/N1,518
NXP

IC AMP AUDIO PWR 50W STER 24HSOP

Package: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

Stock5,792
UJA1164T,118
NXP

IC TRANSCEIVER 14SOIC

Package: 14-SOIC (0.154", 3.90mm Width)

Stock3,360
MC33390DR2
NXP

IC TRANSCEIVER SER LINK 8-SOIC

Package: 8-SOIC (0.154", 3.90mm Width)

Stock258,504
NX3V1G66GW,125
NXP

IC SWITCH SPST 5TSSOP

Package: 5-TSSOP, SC-70-5, SOT-353

Stock5,280
NX3L2T66GM,125
NXP

IC ANALOG SWITCH SPST 8XQFN

Package: 8-XFQFN Exposed Pad

Stock6,880
MPC8535CVTAKGA
NXP

IC MPU MPC85XX 600MHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock6,048
MPC8533VTANG
NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Package: 783-BBGA, FCBGA

Stock4,816
P1022NXN2LFB
NXP

IC MPU Q OR IQ 1.067GHZ 689TBGA

Package: 689-BBGA Exposed Pad

Stock5,808
MCIMX6S5DVM10AC
NXP

IC MPU I.MX6S 1.0GHZ 624MAPBGA

Package: 624-LFBGA

Stock10,680
SPC5602PEF0MLL6
NXP

IC MCU 32BIT 256KB FLASH 100LQFP

Package: 100-LQFP

Stock3,824
ADC1015S065HNC1:5
NXP

ADC 10BIT 65MSPS 40HVQFN

Package: 40-VFQFN Exposed Pad

Stock5,952
MMA6823LKWR2
NXP

ACCELEROMETER 10BIT SPI 16QFN

Package: 16-QFN Exposed Pad

Stock5,814
MW6IC2015GMBR1
NXP

IC PWR AMP RF 26V 15W TO272-16GW

Package: TO-272-16 Variant, Gull Wing

Stock4,842
SAF7751EL/N208Y
NXP

CAR DSP

Package: -

Stock2,192

Part Number	Manufacturer	Description	Package	Stock
MRF6VP3450HSR6	NXP	FET RF 2CH 110V 860MHZ NI1230S Transistor Type: LDMOS (Dual) Frequency: 860MHz Gain: 22.5dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 1.4A Power - Output: 90W Voltage - Rated: 110V Package / Case: NI-1230S Supplier Device Package: NI-1230S	Package: NI-1230S	Stock3,056
2PA1576S/ZLX	NXP	TRANS PNP GEN PURPOSE SC70 Transistor Type: - Current - Collector (Ic) (Max): - Voltage - Collector Emitter Breakdown (Max): - Vce Saturation (Max) @ Ib, Ic: - Current - Collector Cutoff (Max): - DC Current Gain (hFE) (Min) @ Ic, Vce: - Power - Max: - Frequency - Transition: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Supplier Device Package: SOT-323-3	Package: SC-70, SOT-323	Stock4,576
MC34VR500V3ESR2	NXP	IC REG 9OUT BUCK/LDO 56QFN Topology: Step-Down (Buck) (4), Linear (LDO) (5) Function: Communications Processors Number of Outputs: 9 Frequency - Switching: 2MHz Voltage/Current - Output 1: 0.625 V ~ 1.875 V, 4.5A Voltage/Current - Output 2: 0.625 V ~ 1.975 V, 2A Voltage/Current - Output 3: 0.625 V ~ 1.975 V, 2.5A w/LED Driver: No w/Supervisor: No w/Sequencer: No Voltage - Supply: 2.8 V ~ 4.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN (8x8)	Package: 56-VFQFN Exposed Pad	Stock6,384
TEA1995T/1J	NXP	IC CTRLR SYNC RECT 8SOIC Applications: Secondary-Side Controller, Synchronous Rectifier Voltage - Input: - Voltage - Supply: 38V Current - Supply: 160µA Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	Package: 8-SOIC (0.154", 3.90mm Width)	Stock2,864
PCA9553TK,118	NXP	IC LED DRVR LIN DIM 25MA 8HVSON Type: Linear Topology: - Internal Switch(s): Yes Number of Outputs: 4 Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Voltage - Output: - Current - Output / Channel: 25mA Frequency: 400kHz Dimming: I2C Applications: - Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-VFDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	Package: 8-VFDFN Exposed Pad	Stock5,536
CBT6810PW,112	NXP	IC BUS SWITCH 10BIT 24TSSOP Type: Bus Switch Circuit: 10 x 1:1 Independent Circuits: 1 Current - Output High, Low: - Voltage Supply Source: Single Supply Voltage - Supply: 4 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	Package: 24-TSSOP (0.173", 4.40mm Width)	Stock3,296
TDA8922TH/N1,518	NXP	IC AMP AUDIO PWR 50W STER 24HSOP Type: Class D Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 50W x 1 @ 8 Ohm; 40W x 2 @ 8 Ohm Voltage - Supply: ±12.5 V ~ 30 V Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 24-HSOP Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad	Package: 24-BSOP (0.433", 11.00mm Width) Exposed Pad	Stock5,792
UJA1164T,118	NXP	IC TRANSCEIVER 14SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: 200mV Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	Package: 14-SOIC (0.154", 3.90mm Width)	Stock3,360
MC33390DR2	NXP	IC TRANSCEIVER SER LINK 8-SOIC Type: Transceiver Protocol: - Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 200mV Data Rate: 10.4Kbps Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	Package: 8-SOIC (0.154", 3.90mm Width)	Stock258,504
NX3V1G66GW,125	NXP	IC SWITCH SPST 5TSSOP Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Number of Circuits: 1 On-State Resistance (Max): 450 mOhm Channel-to-Channel Matching (ΔRon): - Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): 24ns, 9ns -3db Bandwidth: 25MHz Charge Injection: 12pC Channel Capacitance (CS(off), CD(off)): 70pF Current - Leakage (IS(off)) (Max): 10nA Crosstalk: - Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Supplier Device Package: 5-TSSOP	Package: 5-TSSOP, SC-70-5, SOT-353	Stock5,280
NX3L2T66GM,125	NXP	IC ANALOG SWITCH SPST 8XQFN Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Number of Circuits: 2 On-State Resistance (Max): 750 mOhm Channel-to-Channel Matching (ΔRon): 20 mOhm Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V Voltage - Supply, Dual (V±): - Switch Time (Ton, Toff) (Max): 28ns, 20ns -3db Bandwidth: 60MHz Charge Injection: 6pC Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Crosstalk: -90dB @ 100kHz Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 8-XFQFN Exposed Pad Supplier Device Package: 8-XQFN (1.6x1.6)	Package: 8-XFQFN Exposed Pad	Stock6,880
MPC8535CVTAKGA	NXP	IC MPU MPC85XX 600MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock6,048
MPC8533VTANG	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	Package: 783-BBGA, FCBGA	Stock4,816
P1022NXN2LFB	NXP	IC MPU Q OR IQ 1.067GHZ 689TBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	Package: 689-BBGA Exposed Pad	Stock5,808
MCIMX6S5DVM10AC	NXP	IC MPU I.MX6S 1.0GHZ 624MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	Package: 624-LFBGA	Stock10,680
SPC5602PEF0MLL6	NXP	IC MCU 32BIT 256KB FLASH 100LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 20K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock3,824
ADC1015S065HNC1:5	NXP	ADC 10BIT 65MSPS 40HVQFN Number of Bits: 10 Sampling Rate (Per Second): 65M Number of Inputs: 1 Input Type: Differential, Single Ended Data Interface: LVDS - Parallel, Parallel Configuration: S/H-ADC Ratio - S/H:ADC: 1:1 Number of A/D Converters: 1 Architecture: Pipelined Reference Type: External, Internal Voltage - Supply, Analog: 2.85 V ~ 3.4 V, 5V Voltage - Supply, Digital: 1.65 V ~ 3.6 V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6) Mounting Type: -	Package: 40-VFQFN Exposed Pad	Stock5,952
MMA6823LKWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: Digital Axis: X, Y Acceleration Range: ±50g Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	Package: 16-QFN Exposed Pad	Stock5,814
MW6IC2015GMBR1	NXP	IC PWR AMP RF 26V 15W TO272-16GW Frequency: 1.8GHz ~ 1.99GHz P1dB: - Gain: 26dB Noise Figure: - RF Type: Cellular, W-CDMA, GSM, EDGE, TDMA, CDMA Voltage - Supply: 26V Current - Supply: 100mA Test Frequency: - Package / Case: TO-272-16 Variant, Gull Wing Supplier Device Package: TO-272 WB-16 GULL	Package: TO-272-16 Variant, Gull Wing	Stock4,842
SAF7751EL/N208Y	NXP	CAR DSP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Stock2,192
MCIMX6S4AVM08AD	NXP	I.MX 6S ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	Package: 624-LFBGA	Stock2,448
MCIMX6X3CVO08AC	NXP	I.MX 6SX ROM PERF ENHAN Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	Package: 400-LFBGA	Stock7,856
SPC5746BSK1AMMH6	NXP	SINGLE CORE, 3M FLASH Core Processor: e200z4 Core Size: 32-Bit Speed: 160MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Number of I/O: - Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	Package: 100-LBGA	Stock2,864
SPC5603BK0MLL4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 28K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	Package: 100-LQFP	Stock6,192
LPC55S69JEV98E	NXP	IC MCU 32BIT 640KB FLASH Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 640KB (640K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 320K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 98-VFBGA Supplier Device Package: 98-VFBGA (7x7)	Package: -	Request a Quote
SAF4000EL-101Z201K	NXP	SAF4000EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
SM912G634EV2APR2	NXP	NO DESCRIPTION Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	Package: -	Request a Quote
MMRF1050HR6	NXP	RF MOSFET LDMOS 50V NI1230 Transistor Type: LDMOS (Dual) Frequency: 850MHz ~ 950MHz Gain: 21.3dB Voltage - Test: 50 V Current Rating: 1µA Noise Figure: - Current - Test: 100 mA Power - Output: 1050W Voltage - Rated: 105 V Package / Case: SOT-979A Supplier Device Package: NI-1230-4H	Package: -	Request a Quote