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technology

Latest Technologies of GainSpan Corporation

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2024-02-29, Cascode GaN power devices are packaged with cu clamps for superior power conversion performance

Cascode GaN power devices use a d-mode HEMT device and offer many advantages in higher-power–conversion applications.The cascode architecture with power gallium nitride devices uses a depletion-mode (d-mode) HEMT device and offers many advantages in higher-power–conversion applications.
2023-05-17, The smaller, thinner and lighter FO-USON8 is packaged with 128Mb SPI NOR Flash

Industry leading semiconductor device supplier GigaDevice has announced the launch of SPI NOR Flash GD25LE128EXH in a 3mm×3mm×0.4mm FO-USON8 package with a maximum thickness of only 0.4mm and a capacity of up to 128Mb. It is the smallest plastic packaging product that can be realized in this capacity in the industry at present.
2022-04-10, On-chip inductors for power and RF applications

Gowanda Electronics has launched its first series of ceramic core chip inductors for power applications, the SMP0603. The product line is designed to meet the needs of the power electronics market for high-current processing ceramic chip inductors, and the series of 37 discrete components provide a performance range ranging from 1.8nh to 27nH, DCR ohms from 0.01 to 0.04 and rated current mA DC from 1750 to 3400. The operating temperature of this power series ranges from -40℃ to +125℃.
2022-04-02, Radiation-free audio amplifiers provide excellent audio performance

GaN Systems has introduced a breakthrough gan-based 500W Class D audio amplifier that is smaller, more stylish, more efficient, more powerful than previous generations and delivers better audio quality.