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Aries Electronics |
SOCKET ADAPTER PLCC TO 84DIP 0.6
- Convert From (Adapter End): PLCC
- Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Number of Pins: 84
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
|
Package: - |
Stock4,734 |
|
DIP, 0.6" (15.24mm) Row Spacing | 84 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | FR4 Epoxy Glass |
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|
Aries Electronics |
SOCKET ADAPTER PLCC TO 68DIP 0.9
- Convert From (Adapter End): PLCC
- Convert To (Adapter End): DIP, 0.9" (22.86mm) Row Spacing
- Number of Pins: 68
- Pitch - Mating: -
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
|
Package: - |
Stock8,550 |
|
DIP, 0.9" (22.86mm) Row Spacing | 68 | - | - | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | FR4 Epoxy Glass |
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Aries Electronics |
SOCKET ADAPTER SOJ TO 28DIP 0.4
- Convert From (Adapter End): SOJ
- Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
- Number of Pins: 28
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Housing Material: -
- Board Material: FR4 Epoxy Glass
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Package: - |
Stock4,302 |
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DIP, 0.4" (10.16mm) Row Spacing | 28 | 0.050" (1.27mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | - | FR4 Epoxy Glass |
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Aries Electronics |
SOCKET ADAPTER PLCC TO 68PGA
- Convert From (Adapter End): PLCC
- Convert To (Adapter End): PGA
- Number of Pins: 68
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
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Package: - |
Stock3,436 |
|
PGA | 68 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | FR4 Epoxy Glass |
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Aries Electronics |
SOCKET ADAPTER PLCC TO 28DIP 0.6
- Convert From (Adapter End): PLCC
- Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Number of Pins: 28
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Housing Material: -
- Board Material: FR4 Epoxy Glass
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Package: - |
Stock4,050 |
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DIP, 0.6" (15.24mm) Row Spacing | 28 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Gold | - | FR4 Epoxy Glass |
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Aries Electronics |
SOCKET ADAPTER PLCC TO 68PGA
- Convert From (Adapter End): PLCC
- Convert To (Adapter End): PGA
- Number of Pins: 68
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
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Package: - |
Stock7,164 |
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PGA | 68 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.050" (1.27mm) | Tin-Lead | - | FR4 Epoxy Glass |
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Aries Electronics |
SOCKET ADAPTER PLCC TO 20DIP 0.3
- Convert From (Adapter End): PLCC
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 20
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
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Package: - |
Stock8,208 |
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DIP, 0.3" (7.62mm) Row Spacing | 20 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | FR4 Epoxy Glass |
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3M |
RECEPTACLE DIP SOCKET 40POS 1.0"
- Convert From (Adapter End): -
- Convert To (Adapter End): -
- Number of Pins: -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Mounting Type: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Housing Material: -
- Board Material: -
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Package: - |
Stock6,480 |
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- | - | - | - | - | - | - | - | - | - |
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Aries Electronics |
SOCKET ADAPTER DIP TO 24SOIC
- Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Convert To (Adapter End): SOIC
- Number of Pins: 24
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Mounting Type: Surface Mount
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Board Material: -
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Package: - |
Stock3,420 |
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SOIC | 24 | 0.100" (2.54mm) | Gold | Surface Mount | Solder | 0.050" (1.27mm) | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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Aries Electronics |
DIP-TO-SOWIC ADAPTER
- Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Convert To (Adapter End): SOWIC
- Number of Pins: 20
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Board Material: -
|
Package: - |
Stock2,592 |
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SOWIC | 20 | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.050" (1.27mm) | Tin-Lead | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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Aries Electronics |
SOCKET ADAPT SOIC-W TO 18DIP 0.3
- Convert From (Adapter End): SOIC-W
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 18
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Housing Material: -
- Board Material: FR4 Epoxy Glass
|
Package: - |
Stock7,758 |
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DIP, 0.3" (7.62mm) Row Spacing | 18 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Gold | - | FR4 Epoxy Glass |
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Aries Electronics |
SCK ADAPT 14P SOIC-W TO SOIC 0.6
- Convert From (Adapter End): SOIC-W
- Convert To (Adapter End): SOIC
- Number of Pins: 14
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Surface Mount
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
|
Package: - |
Stock6,624 |
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SOIC | 14 | 0.050" (1.27mm) | - | Surface Mount | Solder | 0.050" (1.27mm) | Tin-Lead | - | FR4 Epoxy Glass |
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Aries Electronics |
SCK ADAPT 10P SOIC-W TO SOIC 0.6
- Convert From (Adapter End): SOIC-W
- Convert To (Adapter End): SOIC
- Number of Pins: 10
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Surface Mount
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
|
Package: - |
Stock8,910 |
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SOIC | 10 | 0.050" (1.27mm) | - | Surface Mount | Solder | 0.050" (1.27mm) | Tin-Lead | - | FR4 Epoxy Glass |
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|
Aries Electronics |
SOCKET ADAPTER SOIC TO 8SOWIC
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): SOWIC
- Number of Pins: 8
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Surface Mount
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
|
Package: - |
Stock5,040 |
|
SOWIC | 8 | 0.050" (1.27mm) | - | Surface Mount | Solder | 0.050" (1.27mm) | Tin-Lead | - | FR4 Epoxy Glass |
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Aries Electronics |
SOCKET ADAPT SOIC-W TO 18DIP 0.3
- Convert From (Adapter End): SOIC-W
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 18
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: FR4 Epoxy Glass
|
Package: - |
Stock3,942 |
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DIP, 0.3" (7.62mm) Row Spacing | 18 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | FR4 Epoxy Glass |
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Aries Electronics |
SOCKET ADAPTER TSOP TO 40DIP
- Convert From (Adapter End): TSOP
- Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Number of Pins: 40
- Pitch - Mating: 0.020" (0.50mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Housing Material: Polyester
- Board Material: FR4 Epoxy Glass
|
Package: - |
Stock7,182 |
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DIP, 0.6" (15.24mm) Row Spacing | 40 | 0.020" (0.50mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyester | FR4 Epoxy Glass |
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Aries Electronics |
SOCKET ADAPTER SOIC TO 8DIP 0.3
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 8
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: Polyimide (PI)
|
Package: - |
Stock4,464 |
|
DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.050" (1.27mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | Polyimide (PI) |
|
|
3M |
RECEPTACLE DIP SOCKET 28POS .6"
- Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Number of Pins: 28
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Housing Material: Polysulfone (PSU), Glass Filled
- Board Material: -
|
Package: - |
Stock8,406 |
|
DIP, 0.6" (15.24mm) Row Spacing | 28 | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polysulfone (PSU), Glass Filled | - |
|
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Logical Systems Inc. |
ADAPTER 32QFN TO 32DIP
- Convert From (Adapter End): -
- Convert To (Adapter End): -
- Number of Pins: -
- Pitch - Mating: -
- Contact Finish - Mating: -
- Mounting Type: -
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Housing Material: -
- Board Material: -
|
Package: - |
Stock2,574 |
|
- | - | - | - | - | - | - | - | - | - |
|
|
3M |
RECEPTACLE DIP SOCKET 24POS .6"
- Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Number of Pins: 24
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Housing Material: Polysulfone (PSU), Glass Filled
- Board Material: -
|
Package: - |
Stock6,804 |
|
DIP, 0.6" (15.24mm) Row Spacing | 24 | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polysulfone (PSU), Glass Filled | - |
|
|
3M |
SOCKET ADAPTER 14DIP TO 14DIP
- Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 14
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Housing Material: Polysulfone (PSU), Glass Filled
- Board Material: -
|
Package: - |
Stock6,192 |
|
DIP, 0.3" (7.62mm) Row Spacing | 14 | 0.100" (2.54mm) | Gold | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polysulfone (PSU), Glass Filled | - |
|
|
Aries Electronics |
SOCKET ADAPTER SOIC-W TO 32DIP
- Convert From (Adapter End): SOIC-W
- Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Number of Pins: 32
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Housing Material: Polyester
- Board Material: FR4 Epoxy Glass
|
Package: - |
Stock8,892 |
|
DIP, 0.6" (15.24mm) Row Spacing | 32 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyester | FR4 Epoxy Glass |
|
|
Logical Systems Inc. |
SOCKET ADAPTER SOIC TO 20DIP
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): DIP
- Number of Pins: 20
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Housing Material: -
- Board Material: -
|
Package: - |
Stock7,398 |
|
DIP | 20 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | - | - | - |
|
|
Aries Electronics |
SOCKET ADAPTER SOIC TO 14DIP
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
- Number of Pins: 14
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Housing Material: Polyester
- Board Material: FR4 Epoxy Glass
|
Package: - |
Stock8,208 |
|
DIP, 0.6" (15.24mm) Row Spacing | 14 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyester | FR4 Epoxy Glass |
|
|
Aries Electronics |
SOCKET ADAPTER TSSOP TO 14DIP
- Convert From (Adapter End): TSSOP
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 14
- Pitch - Mating: 0.026" (0.65mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Housing Material: Polyester
- Board Material: FR4 Epoxy Glass
|
Package: - |
Stock8,640 |
|
DIP, 0.3" (7.62mm) Row Spacing | 14 | 0.026" (0.65mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyester | FR4 Epoxy Glass |
|
|
Aries Electronics |
SOCKET ADAPTER SOIC TO 8DIP 0.3
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 8
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Housing Material: -
- Board Material: Polyimide (PI)
|
Package: - |
Stock80,514 |
|
DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.050" (1.27mm) | Tin | Through Hole | Solder | 0.100" (2.54mm) | Tin-Lead | - | Polyimide (PI) |
|
|
Logical Systems Inc. |
SOCKET ADAPTER SOIC TO 14DIP
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): DIP
- Number of Pins: 14
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Housing Material: -
- Board Material: -
|
Package: - |
Stock6,888 |
|
DIP | 14 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | - | - | - |
|
|
Aries Electronics |
SOCKET ADAPTER SOIC TO 8DIP
- Convert From (Adapter End): SOIC
- Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
- Number of Pins: 8
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: -
- Mounting Type: Through Hole
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Housing Material: Polyester
- Board Material: FR4 Epoxy Glass
|
Package: - |
Stock20,952 |
|
DIP, 0.3" (7.62mm) Row Spacing | 8 | 0.050" (1.27mm) | - | Through Hole | Solder | 0.100" (2.54mm) | Gold | Polyester | FR4 Epoxy Glass |