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technology

Latest Technologies of Kionix Inc.

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2024-12-19, THGBMFG6C1LBAIL e-MMC Module: Working Principle, Pin Connection and Features

The THGBMFG6C1LBAIL is an 8GB e-MMC module housed in a compact 153-ball BGA package. It features Toshiba NAND flash and a controller chip integrated into a Multi-Chip Module (MCM), ensuring high reliability and performance.
2024-02-02, High-speed UFS 4.0 Vehicle storage - Accelerate the development of autonomous driving technology

The evolution of autonomous driving technology is leading to an ever-increasing amount of data being used by vehicles. This requires high-performance storage that can cope with the reading and writing of vast quantities of data. In a move that addresses these demands – and creates a better user experience – KIOXIA has developed automotive storage that complies with the new Universal Flash Storage (UFS) 4.0 standard.
2022-10-22, Kioxia Corporation Announces Next Generation EDSFF E1.S SSDs for Very Large Scale Data Centers

In order to further meet the special requirements of enterprises and data center applications, Kioxia Corporation announced the launch of its XD7P series data center NVMe SSD, consolidating the company's achievements in this field. The Armour XD7P series drive is designed for super large scale and general server applications. It is designed with new enterprise and data center standard outline dimensions (EDSFF) E1.S. It is the second generation of Armour's E1.S SSD that supports NVMe SSDs in the data center of the Open Computing Project (OCP) after the KIOXIA XD6 series
2022-09-03, Strengthening Consumer Embedded Flash Product Lineup

KIOXIA Europe GmbH today announced that it has begun sampling the latest generation of its JEDEC e-MMC Ver. 5.1-compliant embedded flash memory products for consumer applications. The new products are offered in capacities of 64GB and 128GB and combine the company’s BiCS FLASH 3D flash memory and a controller in a single package.
2022-04-05, Embedded flash for devices that require high density

Kioxia Europe GmbH has released the UFS Ver.3.1 embedded flash device using its innovative 4-bit 4-level per cell technology. The UFS PoC is a 512GB prototype with 1TB (128GB) BiCS FLASH 3D FLASH loaded with QLC technology to meet the increasing performance and density requirements of mobile applications, which are driven by higher resolution graphics, 5G networks, 4K + video and more.
2022-04-03, USB TYPE C port protector protects the circuit on system side

KTU1121 USB Type-C port protector provides four USB Type-C CC and SBU signal conduction paths with OVP. USB TypeC port protector SBU and CC switch provides very low pass-through bandwidth wide, enabling high-speed signal through without loss, and the device is packaged in a RoHS and Green compliant 16-Bump WLCSP 1.7mm x 1.7mm package or a 20-pin 3mm x 3mm TQFN package.
2022-03-15, SSDS can now be used in very large data centers

KIOXIA Europe now offers the 9.5mm XD6 series enterprise and Data Center Standard Shape Factor (EDSFF) E1, SSD designed to optimize system density, efficiency and management. Provides higher density, reliability, performance and thermal management. The series is powered by KIOXIA BiCS FLASH 3D FLASH with 1DWPD durability and NVMe 1.3c and PCIe 4.0 specifications with capacities of 1.92TB and 3.84TB, respectively. The capacity is 1.92TB and 3.84TB, respectively. A TCG-OPal 2.0 encryption option is also provided.