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Sockets for ICs, Transistors - Adapters

Records 353
Page  2/12
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Convert To (Adapter End)
Number of Pins
Pitch - Mating
Contact Finish - Mating
Mounting Type
Termination
Pitch - Post
Contact Finish - Post
Housing Material
Board Material
84-653000-11-RC
Aries Electronics

SOCKET ADAPTER PLCC TO 84DIP 0.6

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 84
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock7,380
DIP, 0.6" (15.24mm) Row Spacing
84
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
48-6645-18
Aries Electronics

SOCKET ADAPTER TQFP TO 48DIP 0.6

  • Convert From (Adapter End): TQFP
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 48
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock7,830
DIP, 0.6" (15.24mm) Row Spacing
48
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
97-56001
Aries Electronics

SOCKET ADAPTER QFP TO 169PGA

  • Convert From (Adapter End): QFP
  • Convert To (Adapter End): PGA
  • Number of Pins: 169
  • Pitch - Mating: 0.025" (0.64mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock4,158
PGA
169
0.025" (0.64mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
232-1285-39-0602J
3M

RECEPTACLE DIP SOCKET 32POS .6"

  • Convert From (Adapter End): -
  • Convert To (Adapter End): -
  • Number of Pins: -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Package: -
Stock2,196
-
-
-
-
-
-
-
-
-
-
240-3639-19-0602J
3M

RECEPTACLE DIP SOCKET 40POS 1.0"

  • Convert From (Adapter End): -
  • Convert To (Adapter End): -
  • Number of Pins: -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Package: -
Stock4,914
-
-
-
-
-
-
-
-
-
-
16-651000-10
Aries Electronics

SOCKET ADAPTER SSOP TO 16DIP 0.6

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 16
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock8,982
DIP, 0.6" (15.24mm) Row Spacing
16
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
1107254-40
Aries Electronics

SOCKET ADAPTER DIP TO 40DIP 0.3

  • Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 40
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
Package: -
Stock3,762
DIP, 0.3" (7.62mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
224-5248-09-0602J
3M

RECEPTACLE DIP SOCKET 24POS .3"

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 24
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polysulfone (PSU), Glass Filled
  • Board Material: -
Package: -
Stock6,012
DIP, 0.3" (7.62mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
20-350001-11-RC
Aries Electronics

SOCKET ADAPTER SOJ TO 20DIP 0.3

  • Convert From (Adapter End): SOJ
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock2,412
DIP, 0.3" (7.62mm) Row Spacing
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin
-
FR4 Epoxy Glass
68-505-110-P
Aries Electronics

SOCKET ADAPTER PLCC TO 68PGA

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): PGA
  • Number of Pins: 68
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock7,470
PGA
68
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
18-35W000-10
Aries Electronics

SOCKET ADAPT SOIC-W TO 18DIP 0.3

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 18
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock7,902
DIP, 0.3" (7.62mm) Row Spacing
18
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
08-301296-10
Aries Electronics

SOCKET ADAPTER SOIC TO TO-8

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): JEDEC
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock5,922
JEDEC
8
0.050" (1.27mm)
-
Through Hole
Solder
-
Tin-Lead
-
FR4 Epoxy Glass
44-505-111
Aries Electronics

SOCKET ADAPTER PLCC TO 44PGA

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): PGA
  • Number of Pins: 44
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock8,982
PGA
44
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
32-354000-10
Aries Electronics

SOCKET ADAPTER DIP TO 32SOIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOIC
  • Number of Pins: 32
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
Package: -
Stock7,524
SOIC
32
-
Gold
Surface Mount
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
28-505-110
Aries Electronics

SOCKET ADAPTER PLCC TO 28PGA

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): PGA
  • Number of Pins: 28
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock3,546
PGA
28
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
LCQT-QFP0.65-52
Aries Electronics

SOCKET ADAPTER MULT PKG TO 52QFP

  • Convert From (Adapter End): Multiple Packages
  • Convert To (Adapter End): QFP
  • Number of Pins: 52
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
Package: -
Stock2,124
QFP
52
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
22-350000-10
Aries Electronics

SOCKET ADAPTER SOIC TO 22DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 22
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
Package: -
Stock5,958
DIP, 0.3" (7.62mm) Row Spacing
22
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
LCQT-TSOP40-1
Aries Electronics

SOCKET ADAPTER TSOP TO 40DIP

  • Convert From (Adapter End): TSOP
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 40
  • Pitch - Mating: 0.020" (0.50mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
Package: -
Stock2,682
DIP, 0.6" (15.24mm) Row Spacing
40
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
228-4817-19-0602J
3M

RECEPTACLE DIP SOCKET 28POS .4"

  • Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polysulfone (PSU), Glass Filled
  • Board Material: -
Package: -
Stock4,536
DIP, 0.4" (10.16mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
LCQT-QFP0.65-64
Aries Electronics

SOCKET ADAPTER MULT PKG TO 64QFP

  • Convert From (Adapter End): Multiple Packages
  • Convert To (Adapter End): QFP
  • Number of Pins: 64
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
Package: -
Stock6,132
QFP
64
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
240-1280-09-0602J
3M

SOCKET ADAPTER 40DIP TO 40DIP

  • Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 40
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polysulfone (PSU), Glass Filled
  • Board Material: -
Package: -
Stock4,770
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
32-653000-10
Aries Electronics

SOCKET ADAPTER PLCC TO 32DIP 0.6

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 32
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock5,418
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
14-351000-10
Aries Electronics

SOCKET ADAPTER SSOP TO 14DIP 0.3

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 14
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock6,534
DIP, 0.3" (7.62mm) Row Spacing
14
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
20-35W000-11-RC
Aries Electronics

SOCKET ADAPT SOIC-W TO 20DIP 0.3

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock6,084
DIP, 0.3" (7.62mm) Row Spacing
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
LCQT-QFP0.5-32
Aries Electronics

SOCKET ADAPTER MULT PKG TO 32QFP

  • Convert From (Adapter End): Multiple Packages
  • Convert To (Adapter End): QFP
  • Number of Pins: 32
  • Pitch - Mating: 0.020" (0.50mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
Package: -
Stock6,696
QFP
32
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
LCQT-TSOP32-1
Aries Electronics

SOCKET ADAPTER TSOP TO 32DIP

  • Convert From (Adapter End): TSOP
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 32
  • Pitch - Mating: 0.020" (0.50mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
Package: -
Stock5,328
DIP, 0.6" (15.24mm) Row Spacing
32
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
24-350000-10
Aries Electronics

SOCKET ADAPTER SOIC TO 24DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 24
  • Pitch - Mating: -
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
Package: -
Stock6,876
DIP, 0.3" (7.62mm) Row Spacing
24
-
Tin
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
Polyimide (PI)
28-350002-10
Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock9,156
DIP, 0.3" (7.62mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
24-350000-11-RC
Aries Electronics

SOCKET ADAPTER SOIC TO 24DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 24
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
Package: -
Stock16,356
DIP, 0.3" (7.62mm) Row Spacing
24
-
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
Polyimide (PI)
PA-SOD3SM18-16
Logical Systems Inc.

SOCKET ADAPTER SOIC TO 16DIP

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP
  • Number of Pins: 16
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Package: -
Stock15,780
DIP
16
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-