Page 2 - Sockets for ICs, Transistors - Adapters | Connectors, Interconnects

84-653000-11-RC
Aries Electronics

SOCKET ADAPTER PLCC TO 84DIP 0.6

Package: -

Stock7,380
48-6645-18
Aries Electronics

SOCKET ADAPTER TQFP TO 48DIP 0.6

Package: -

Stock7,830
97-56001
Aries Electronics

SOCKET ADAPTER QFP TO 169PGA

Package: -

Stock4,158
232-1285-39-0602J
3M

RECEPTACLE DIP SOCKET 32POS .6"

Package: -

Stock2,196
240-3639-19-0602J
3M

RECEPTACLE DIP SOCKET 40POS 1.0"

Package: -

Stock4,914
264-1300-29-0602J
3M

RECEPTACLE DIP SOCKET 64POS .8"

Package: -

Stock4,140
16-651000-10
Aries Electronics

SOCKET ADAPTER SSOP TO 16DIP 0.6

Package: -

Stock8,982
1107254-40
Aries Electronics

SOCKET ADAPTER DIP TO 40DIP 0.3

Package: -

Stock3,762
224-5248-09-0602J
3M

RECEPTACLE DIP SOCKET 24POS .3"

Package: -

Stock6,012
20-350001-11-RC
Aries Electronics

SOCKET ADAPTER SOJ TO 20DIP 0.3

Package: -

Stock2,412
68-505-110-P
Aries Electronics

SOCKET ADAPTER PLCC TO 68PGA

Package: -

Stock7,470
18-35W000-10
Aries Electronics

SOCKET ADAPT SOIC-W TO 18DIP 0.3

Package: -

Stock7,902
44-505-111
Aries Electronics

SOCKET ADAPTER PLCC TO 44PGA

Package: -

Stock8,982
32-354000-10
Aries Electronics

SOCKET ADAPTER DIP TO 32SOIC

Package: -

Stock7,524
28-505-110
Aries Electronics

SOCKET ADAPTER PLCC TO 28PGA

Package: -

Stock3,546
LCQT-QFP0.65-52
Aries Electronics

SOCKET ADAPTER MULT PKG TO 52QFP

Package: -

Stock2,124
22-350000-10
Aries Electronics

SOCKET ADAPTER SOIC TO 22DIP 0.3

Package: -

Stock5,958
LCQT-TSOP40-1
Aries Electronics

SOCKET ADAPTER TSOP TO 40DIP

Package: -

Stock2,682
228-4817-19-0602J
3M

RECEPTACLE DIP SOCKET 28POS .4"

Package: -

Stock4,536
LCQT-QFP0.65-64
Aries Electronics

SOCKET ADAPTER MULT PKG TO 64QFP

Package: -

Stock6,132

Part Number	Manufacturer	Description	Package	Stock	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
84-653000-11-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 84DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 84 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,380	DIP, 0.6" (15.24mm) Row Spacing	84	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
48-6645-18	Aries Electronics	SOCKET ADAPTER TQFP TO 48DIP 0.6 Convert From (Adapter End): TQFP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 48 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,830	DIP, 0.6" (15.24mm) Row Spacing	48	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
97-56001	Aries Electronics	SOCKET ADAPTER QFP TO 169PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 169 Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,158	PGA	169	0.025" (0.64mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
232-1285-39-0602J	3M	RECEPTACLE DIP SOCKET 32POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock2,196	-	-	-	-	-	-	-	-	-	-
240-3639-19-0602J	3M	RECEPTACLE DIP SOCKET 40POS 1.0" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock4,914	-	-	-	-	-	-	-	-	-	-
264-1300-29-0602J	3M	RECEPTACLE DIP SOCKET 64POS .8" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock4,140	-	-	-	-	-	-	-	-	-	-
16-651000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 16DIP 0.6 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock8,982	DIP, 0.6" (15.24mm) Row Spacing	16	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
1107254-40	Aries Electronics	SOCKET ADAPTER DIP TO 40DIP 0.3 Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 40 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock3,762	DIP, 0.3" (7.62mm) Row Spacing	40	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
224-5248-09-0602J	3M	RECEPTACLE DIP SOCKET 24POS .3" Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	Package: -	Stock6,012	DIP, 0.3" (7.62mm) Row Spacing	24	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
20-350001-11-RC	Aries Electronics	SOCKET ADAPTER SOJ TO 20DIP 0.3 Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock2,412	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin	-	FR4 Epoxy Glass
68-505-110-P	Aries Electronics	SOCKET ADAPTER PLCC TO 68PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 68 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,470	PGA	68	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
18-35W000-10	Aries Electronics	SOCKET ADAPT SOIC-W TO 18DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 18 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,902	DIP, 0.3" (7.62mm) Row Spacing	18	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
44-505-111	Aries Electronics	SOCKET ADAPTER PLCC TO 44PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 44 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock8,982	PGA	44	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
32-354000-10	Aries Electronics	SOCKET ADAPTER DIP TO 32SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 32 Pitch - Mating: - Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock7,524	SOIC	32	-	Gold	Surface Mount	Solder	0.100" (2.54mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
28-505-110	Aries Electronics	SOCKET ADAPTER PLCC TO 28PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,546	PGA	28	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
LCQT-QFP0.65-52	Aries Electronics	SOCKET ADAPTER MULT PKG TO 52QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 52 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock2,124	QFP	52	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
22-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 22DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 22 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock5,958	DIP, 0.3" (7.62mm) Row Spacing	22	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
LCQT-TSOP40-1	Aries Electronics	SOCKET ADAPTER TSOP TO 40DIP Convert From (Adapter End): TSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 40 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock2,682	DIP, 0.6" (15.24mm) Row Spacing	40	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
228-4817-19-0602J	3M	RECEPTACLE DIP SOCKET 28POS .4" Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	Package: -	Stock4,536	DIP, 0.4" (10.16mm) Row Spacing	28	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
LCQT-QFP0.65-64	Aries Electronics	SOCKET ADAPTER MULT PKG TO 64QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 64 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock6,132	QFP	64	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
240-1280-09-0602J	3M	SOCKET ADAPTER 40DIP TO 40DIP Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 40 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	Package: -	Stock4,770	DIP, 0.6" (15.24mm) Row Spacing	40	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
32-653000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 32DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock5,418	DIP, 0.6" (15.24mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
20-35W000-11-RC	Aries Electronics	SOCKET ADAPT SOIC-W TO 20DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock6,084	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
LCQT-QFP0.5-32	Aries Electronics	SOCKET ADAPTER MULT PKG TO 32QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 32 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock6,696	QFP	32	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
LCQT-TSOP32-1	Aries Electronics	SOCKET ADAPTER TSOP TO 32DIP Convert From (Adapter End): TSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock5,328	DIP, 0.6" (15.24mm) Row Spacing	32	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
LCQT-TSOP32	Aries Electronics	SOCKET ADAPTER TSOP 32DIP Convert From (Adapter End): TSOP Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock6,768	DIP, 0.6" (15.24mm) Row Spacing	32	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
24-350000-10	Aries Electronics	SOCKET ADAPTER SOIC TO 24DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock6,876	DIP, 0.3" (7.62mm) Row Spacing	24	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)
24-350000-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 24DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock16,356	DIP, 0.3" (7.62mm) Row Spacing	24	-	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)