Page 3 - Sockets for ICs, Transistors - Adapters | Connectors, Interconnects

97-68340
Aries Electronics

SOCKET ADAPTER QFP TO 144PGA

Package: -

Stock7,902
68-653000-10
Aries Electronics

SOCKET ADAPTER PLCC TO 68DIP 0.6

Package: -

Stock8,280
290-1294-29-0602J
3M

RECEPTACLE DIP SOCKET 90POS .9"

Package: -

Stock2,340
1109252
Aries Electronics

SOCKET ADAPTER PLCC TO 28DIP 0.6

Package: -

Stock5,706
28-353000-10
Aries Electronics

SOCKET ADAPTER PLCC TO 28DIP 0.3

Package: -

Stock6,300
28-354000-21-RC
Aries Electronics

SOCKET ADAPTER DIP TO 28SOIC

Package: -

Stock6,372
PA-SOD6SM18-40
Logical Systems Inc.

ADAPTER 40SOIC TO 40DIP

Package: -

Stock8,640
248-1282-09-0602J
3M

RECEPTACLE DIP SOCKET 48POS .6"

Package: -

Stock5,760
222-3343-09-0602J
3M

SOCKET ADAPTER 22DIP TO 22DIP

Package: -

Stock3,312
28-350002-11-RC
Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.3

Package: -

Stock4,518
24-351000-10
Aries Electronics

SOCKET ADAPTER SSOP TO 24DIP 0.3

Package: -

Stock3,258
28-35W000-11-RC
Aries Electronics

SOCKET ADAPT SOIC-W TO 28DIP 0.3

Package: -

Stock3,708
12-665000-00
Aries Electronics

SCK ADAPT 12P SOIC-W TO SOIC 0.6

Package: -

Stock2,016
20-35W000-10
Aries Electronics

SOCKET ADAPT SOIC-W TO 20DIP 0.3

Package: -

Stock8,784
08-301296-10
Aries Electronics

SOCKET ADAPTER SOIC TO TO-8

Package: -

Stock5,922
16-307349-11-RC-P (170 UP)
Aries Electronics

SOCKET ADAPTER PLCC TO 16DIP 0.3

Package: -

Stock5,598
LCQT-QFP0.5-60
Aries Electronics

SOCKET ADAPTER MULT PKG TO 60QFP

Package: -

Stock2,934
1107254-16
Aries Electronics

SOCKET ADAPTER DIP TO 16DIP 0.3

Package: -

Stock7,218
14-350000-10-P
Aries Electronics

SOCKET ADAPTER SOIC TO 14DIP 0.3

Package: -

Stock3,834
32-450001-10
Aries Electronics

SOCKET ADAPTER SOJ TO 32DIP 0.4

Package: -

Stock4,662

Part Number	Manufacturer	Description	Package	Stock	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
97-68340	Aries Electronics	SOCKET ADAPTER QFP TO 144PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 144 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,902	PGA	144	0.026" (0.65mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin	-	FR4 Epoxy Glass
68-653000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 68DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 68 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock8,280	DIP, 0.6" (15.24mm) Row Spacing	68	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
290-1294-29-0602J	3M	RECEPTACLE DIP SOCKET 90POS .9" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock2,340	-	-	-	-	-	-	-	-	-	-
1109252	Aries Electronics	SOCKET ADAPTER PLCC TO 28DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock5,706	DIP, 0.6" (15.24mm) Row Spacing	28	-	-	Through Hole	Solder	0.070" (1.78mm)	Tin-Lead	-	FR4 Epoxy Glass
28-353000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 28DIP 0.3 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock6,300	DIP, 0.3" (7.62mm) Row Spacing	28	0.050" (1.27mm)	Tin-Lead	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
28-354000-21-RC	Aries Electronics	SOCKET ADAPTER DIP TO 28SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 28 Pitch - Mating: - Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock6,372	SOIC	28	-	Gold	Surface Mount	Solder	0.100" (2.54mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
PA-SOD6SM18-40	Logical Systems Inc.	ADAPTER 40SOIC TO 40DIP Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock8,640	-	-	-	-	-	-	-	-	-	-
248-1282-09-0602J	3M	RECEPTACLE DIP SOCKET 48POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock5,760	-	-	-	-	-	-	-	-	-	-
222-3343-09-0602J	3M	SOCKET ADAPTER 22DIP TO 22DIP Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 22 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	Package: -	Stock3,312	DIP, 0.4" (10.16mm) Row Spacing	22	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
28-350002-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,518	DIP, 0.3" (7.62mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
24-351000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 24DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,258	DIP, 0.3" (7.62mm) Row Spacing	24	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
28-35W000-11-RC	Aries Electronics	SOCKET ADAPT SOIC-W TO 28DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,708	DIP, 0.3" (7.62mm) Row Spacing	28	-	-	Through Hole	Solder	0.050" (1.27mm)	Gold	-	FR4 Epoxy Glass
12-665000-00	Aries Electronics	SCK ADAPT 12P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 12 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock2,016	SOIC	12	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
20-35W000-10	Aries Electronics	SOCKET ADAPT SOIC-W TO 20DIP 0.3 Convert From (Adapter End): SOIC-W Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock8,784	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
08-301296-10	Aries Electronics	SOCKET ADAPTER SOIC TO TO-8 Convert From (Adapter End): SOIC Convert To (Adapter End): JEDEC Number of Pins: 8 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock5,922	JEDEC	8	0.050" (1.27mm)	-	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
16-307349-11-RC-P (170 UP)	Aries Electronics	SOCKET ADAPTER PLCC TO 16DIP 0.3 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock5,598	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
LCQT-QFP0.5-60	Aries Electronics	SOCKET ADAPTER MULT PKG TO 60QFP Convert From (Adapter End): Multiple Packages Convert To (Adapter End): QFP Number of Pins: 60 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock2,934	QFP	60	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
1107254-16	Aries Electronics	SOCKET ADAPTER DIP TO 16DIP 0.3 Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock7,218	DIP, 0.3" (7.62mm) Row Spacing	16	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
14-350000-10-P	Aries Electronics	SOCKET ADAPTER SOIC TO 14DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 14 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock3,834	DIP, 0.3" (7.62mm) Row Spacing	14	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
32-450001-10	Aries Electronics	SOCKET ADAPTER SOJ TO 32DIP 0.4 Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock4,662	DIP, 0.4" (10.16mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	FR4 Epoxy Glass
214-3339-19-0602J	3M	RECEPTACLE DIP SOCKET 14POS .3" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock5,382	-	-	-	-	-	-	-	-	-	-
14-351000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 14DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 14 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock6,534	DIP, 0.3" (7.62mm) Row Spacing	14	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
240-1280-19-0602J	3M	RECEPTACLE DIP SOCKET 40POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock5,472	-	-	-	-	-	-	-	-	-	-
28-350002-10	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock9,156	DIP, 0.3" (7.62mm) Row Spacing	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
1109523	Aries Electronics	SOCKET ADAPTER DIP TO TO-8 Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): JEDEC Number of Pins: 8 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: FR4 Epoxy Glass	Package: -	Stock6,132	JEDEC	8	0.100" (2.54mm)	Gold	Through Hole	Solder	-	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	FR4 Epoxy Glass
28-650000-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.6 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock6,396	DIP, 0.6" (15.24mm) Row Spacing	28	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
68-505-110	Aries Electronics	SOCKET ADAPTER PLCC TO 68PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 68 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,716	PGA	68	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
PA-SOD3SM18-16	Logical Systems Inc.	SOCKET ADAPTER SOIC TO 16DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP Number of Pins: 16 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock15,780	DIP	16	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-