Page 4 - Sockets for ICs, Transistors - Adapters | Connectors, Interconnects

MIKROE-231
MikroElektronika

SOCKET ADAPTER AT90PWM2 TO 40DIP

Package: -

Stock8,082
95-100I25
Aries Electronics

SOCKET ADAPTER QFP TO 100PGA

Package: -

Stock2,376
MIKROE-230
MikroElektronika

SOCKET ADAPTER AT90PWM1 TO 40DIP

Package: -

Stock2,106
1111163
Aries Electronics

SOCKET ADAPTER SOCKET TO 40PLCC

Package: -

Stock3,078
68-652000-10
Aries Electronics

SOCKET ADAPTER PLCC TO 68DIP 0.6

Package: -

Stock7,398
160-306045-10
Aries Electronics

SOCKET ADAPTER QFP THRU HOLE

Package: -

Stock2,196
44-652000-11-RC
Aries Electronics

SOCKET ADAPTER PLCC TO 44DIP 0.6

Package: -

Stock3,258
PA-TS1D6SM18-56
Logical Systems Inc.

ADAPTER 56TSOP TO 56DIP

Package: -

Stock7,434
20-353000-10
Aries Electronics

SOCKET ADAPTER PLCC TO 20DIP 0.3

Package: -

Stock8,694
24-650000-11-RC
Aries Electronics

SOCKET ADAPTER SOIC TO 24DIP 0.6

Package: -

Stock2,322
240-1280-39-0602J
3M

RECEPTACLE DIP SOCKET 40POS .6"

Package: -

Stock4,950
228-1290-09-0602J
3M

RECEPTACLE DIP SOCKET 28POS .4"

Package: -

Stock3,562
08-354000-11-RC
Aries Electronics

SOCKET ADAPTER DIP TO 8SOIC

Package: -

Stock3,348
14-354W00-10
Aries Electronics

CONN ADAPTER 14PIN DIP TO SOWIC

Package: -

Stock5,940
12-350000-10-HT
Aries Electronics

SOCKET ADAPTER SOIC TO 12DIP 0.3

Package: -

Stock8,802
28-665000-00
Aries Electronics

SCK ADAPT 28P SOIC-W TO SOIC 0.6

Package: -

Stock6,012
22-665000-00
Aries Electronics

SCK ADAPT 22P SOIC-W TO SOIC 0.6

Package: -

Stock3,562
18-350000-10-HT
Aries Electronics

SOCKET ADAPTER SOIC TO 18DIP 0.3

Package: -

Stock6,156
1106396-14
Aries Electronics

SOCKET ADAPTER DIP TO 14DIP 0.6

Package: -

Stock8,820
1107254-08
Aries Electronics

SOCKET ADAPTER DIP TO 8DIP 0.3

Package: -

Stock3,544

Part Number	Manufacturer	Description	Package	Stock	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
MIKROE-231	MikroElektronika	SOCKET ADAPTER AT90PWM2 TO 40DIP Convert From (Adapter End): AT90PWM2 Convert To (Adapter End): DIP Number of Pins: 40 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock8,082	DIP	40	-	-	-	-	-	-	-	-
95-100I25	Aries Electronics	SOCKET ADAPTER QFP TO 100PGA Convert From (Adapter End): QFP Convert To (Adapter End): PGA Number of Pins: 100 Pitch - Mating: 0.025" (0.64mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock2,376	PGA	100	0.025" (0.64mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
MIKROE-230	MikroElektronika	SOCKET ADAPTER AT90PWM1 TO 40DIP Convert From (Adapter End): AT90PWM1 Convert To (Adapter End): DIP Number of Pins: 40 Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock2,106	DIP	40	-	-	-	-	-	-	-	-
1111163	Aries Electronics	SOCKET ADAPTER SOCKET TO 40PLCC Convert From (Adapter End): Socket, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): PLCC Number of Pins: 40 Pitch - Mating: - Contact Finish - Mating: Gold Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: FR4 Epoxy Glass	Package: -	Stock3,078	PLCC	40	-	Gold	-	-	-	-	Polyamide (PA46), Nylon 4/6, Glass Filled	FR4 Epoxy Glass
68-652000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 68DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 68 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock7,398	DIP, 0.6" (15.24mm) Row Spacing	68	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
160-306045-10	Aries Electronics	SOCKET ADAPTER QFP THRU HOLE Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock2,196	-	-	-	-	-	-	-	-	-	-
44-652000-11-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 44DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 44 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,258	DIP, 0.6" (15.24mm) Row Spacing	44	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
PA-TS1D6SM18-56	Logical Systems Inc.	ADAPTER 56TSOP TO 56DIP Convert From (Adapter End): TSOP Convert To (Adapter End): DIP Number of Pins: 56 Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock7,434	DIP	56	0.020" (0.50mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
20-353000-10	Aries Electronics	SOCKET ADAPTER PLCC TO 20DIP 0.3 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 20 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock8,694	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	Tin-Lead	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
24-650000-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 24DIP 0.6 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 24 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock2,322	DIP, 0.6" (15.24mm) Row Spacing	24	0.050" (1.27mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
240-1280-39-0602J	3M	RECEPTACLE DIP SOCKET 40POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock4,950	-	-	-	-	-	-	-	-	-	-
228-1290-09-0602J	3M	RECEPTACLE DIP SOCKET 28POS .4" Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Gold Housing Material: Polysulfone (PSU), Glass Filled Board Material: -	Package: -	Stock3,562	DIP, 0.4" (10.16mm) Row Spacing	28	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	Gold	Polysulfone (PSU), Glass Filled	-
08-354000-11-RC	Aries Electronics	SOCKET ADAPTER DIP TO 8SOIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOIC Number of Pins: 8 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock3,348	SOIC	8	0.100" (2.54mm)	Gold	Surface Mount	Solder	0.050" (1.27mm)	Gold	Polyamide (PA46), Nylon 4/6, Glass Filled	-
14-354W00-10	Aries Electronics	CONN ADAPTER 14PIN DIP TO SOWIC Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): SOWIC Number of Pins: 14 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock5,940	SOWIC	14	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
12-350000-10-HT	Aries Electronics	SOCKET ADAPTER SOIC TO 12DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 12 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock8,802	DIP, 0.3" (7.62mm) Row Spacing	12	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
28-665000-00	Aries Electronics	SCK ADAPT 28P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock6,012	SOIC	28	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
22-665000-00	Aries Electronics	SCK ADAPT 22P SOIC-W TO SOIC 0.6 Convert From (Adapter End): SOIC-W Convert To (Adapter End): SOIC Number of Pins: 22 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock3,562	SOIC	22	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
18-350000-10-HT	Aries Electronics	SOCKET ADAPTER SOIC TO 18DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 18 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock6,156	DIP, 0.3" (7.62mm) Row Spacing	18	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
1106396-14	Aries Electronics	SOCKET ADAPTER DIP TO 14DIP 0.6 Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 14 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock8,820	DIP, 0.6" (15.24mm) Row Spacing	14	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
1107254-08	Aries Electronics	SOCKET ADAPTER DIP TO 8DIP 0.3 Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 8 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Board Material: -	Package: -	Stock3,544	DIP, 0.3" (7.62mm) Row Spacing	8	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
PA-SSD3SM18-18	Logical Systems Inc.	SOCKET ADAPTER SSOP TO 18DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 18 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock7,218	DIP	18	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
PA-SSD3SM18-28	Logical Systems Inc.	SOCKET ADAPTER SSOP TO 28DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 28 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock4,896	DIP	28	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
240-1280-29-0602J	3M	RECEPTACLE DIP SOCKET 40POS .6" Convert From (Adapter End): - Convert To (Adapter End): - Number of Pins: - Pitch - Mating: - Contact Finish - Mating: - Mounting Type: - Termination: - Pitch - Post: - Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock7,704	-	-	-	-	-	-	-	-	-	-
28-351000-10	Aries Electronics	SOCKET ADAPTER SSOP TO 28DIP 0.3 Convert From (Adapter End): SSOP Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 28 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock8,496	DIP, 0.3" (7.62mm) Row Spacing	28	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
PA-SSD6SM18-24	Logical Systems Inc.	ADAPTER 24TSSOP TO 24DIP Convert From (Adapter End): SSOP Convert To (Adapter End): DIP Number of Pins: 24 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Housing Material: - Board Material: -	Package: -	Stock5,472	DIP	24	0.026" (0.65mm)	-	Through Hole	Solder	0.100" (2.54mm)	-	-	-
LCQT-SOIC32	Aries Electronics	SOCKET ADAPTER SOIC TO 32DIP Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: Polyester Board Material: FR4 Epoxy Glass	Package: -	Stock4,734	DIP, 0.6" (15.24mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	Polyester	FR4 Epoxy Glass
32-650000-10	Aries Electronics	SOCKET ADAPTER SOJ TO 32DIP 0.6 Convert From (Adapter End): SOJ Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	Package: -	Stock10,404	DIP, 0.6" (15.24mm) Row Spacing	32	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
16-350000-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 16DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 16 Pitch - Mating: - Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	Package: -	Stock34,182	DIP, 0.3" (7.62mm) Row Spacing	16	-	Tin	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	Polyimide (PI)